Packaging Services

Material selection

Material selection is the key for any product. We will act as a bridge between the material supplier and business customer.

We will initially identify the right (commercially) available materials that fit the needs of your application. Material identification will be done based on: 

I.  Material properties (Thermal/Mechanical/Electrical etc.); 

II. Discussions with different material suppliers.

Material characterization

We can propose relavent material characterization techniques and testing methods to achieve the required properties. Characterization support can be given if needed (only in consultation with business customer).

Material Innovation

Also, provide an innovative material design to attain desired properties. The material design can be done via. chemistry, new formulation etc.

Design selection 

Process selection

The typical packaging processes are dispensing, chip attach, curing, sintering, molding etc.  For any kind of process, it is inevitable to keep the specification under control or deviation should be within limits. Further, process should be repeatable and reproducible. We have strong expertise in applying lean six-sigma DMAIC approach to keep the process under control. 

FEM Simulations

FEM simulations can be done to determine the package stresses, warpage, cracks, delamination, etc. We input the right material properties, designs and their combinations during simulations to achieve low (or desired) stresses.  We have expertise in performing elastic, viscoelastic, viscoplastic, delamination etc. 

Innovation

EPMDI will do Innovation targeting materials, desings and processes. We look for opportunity to patent our innovation ideas as well.

Package designs are critical for any product. Mainly because the stress concentrations are introduced with a poor design. Further, the stresses are amplified when subjected to mechanical, thermal loads. The stress concentrations can reach a critical level and might lead to failures like cracks, delaminations etc.